Solvay expands range of FusePly covalent bonding for composite structures

Solvay (Alpharetta, Ga., U.S.) has expanded its range of FusePly chemical bonding technology with a second product, FusePly 250, designed to bond composite structures at 250°F and higher. The new product complements the previous FusePly 100 grade, introduced in 2018 which has now been renamed FusePly 350 to reflect its compatibility with 350°F cure film adhesives. Both grades offer step-change bonding performance and durability and can easily be integrated into existing manufacturing processes as an upgrade for traditional surface preparation methods.

Solvay reports that FusePly is a breakthrough composite bonding technology resulting in covalent bonds between adhesives and composite structures. While it handles and processes like a conventional peel ply product, it creates a reliable chemically functionalized composite surface which eliminates time- and labor-intensive surface preparation steps and assembly processes.

“The reliability and robustness of bonded structures are a top priority for users of composites in safety-critical applications in aerospace and other demanding markets” says Stephen Heinz, VP research and innovation for Solvay’s global Composite Materials business unit. “We developed FusePly, a fundamentally new bonding approach, to meet the needs of leading aircraft OEMs and enable them to take full advantage of composites for lighter, stronger structures.”