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3/5/2019 | 1 MINUTE READ

JEC World 2019 preview: Netzsch

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Netzsch (Selb, Germany, 6/R20) is featuring technology it developed in collaboration with Kistler (Winterhur, Switzerland) to create advanced technology for intelligent composites parts production.

Netzsch (Selb, Germany, 6/R20) is featuring technology it developed in collaboration with Kistler (Winterhur, Switzerland) to create advanced technology for intelligent composites parts production. The technology integrates dielectric sensors from Netzsch that determine characteristic values of fiber-reinforced composites and plastics during part manufacturing, with Kistler’s ComoNeo process monitoring system, which now includes the ComoNeoCOMPOSITES feature to allow process monitoring for cycles of up to eight hours.

These integrated systems are being demonstrated live at JEC World 2019. In the demonstration, dielectric analysis (DEA) signals supplied by Netzsch sensors are integrated directly into ComoNeo. “Many of our customers are already using one of these two systems, or even both of them – but without a common interface,” says Dr. Alexander Chaloupka, manager of the Process Analytics Business Field at Netzsch. “The dielectric signal provides information about the degree of cross-linking during the curing process, so it is a key indicator of quality for parts made from composite materials. The same is true of cavity pressure as measured by Kistler’s equipment – so these two technologies complement one another excellently.”

Netzsch says mold filling and material cross-linking can now be monitored by a complete, coordinated system thanks to the combination of DEA sensor technology from Netzsch and Kistler’s cavity pressure sensor technology. “There’s no doubt that this moves quality assurance up to a new level,” according to Dr. Robert Vaculik, head of Kistler’s Strategic Business Field Plastics. “More extensive control of the manufacturing process means that users can increase their throughput rates and continue to make their production more cost-efficient.”

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