Resin Transfer Molding (RTM)

Composite Integration launches resin transfer molding, infusion technologies
The company’s modular infusion manifold automates the infusion process to simplify manufacture of large composite structures.

Presidium launches fast-cure, high-strength resin system
Presidium USA is introducing to the composites manufacturing market the RevoTherm line of resin systems that offer low viscosity, fast cure and high strength in finished parts.

CAMX 2019 exhibit preview: Design Concepts
Design Concepts is emphasizing its closed mold applications for both tooling and manufacturing in the entertainment, simulation, aerospace and wind energy markets.

Sicomin launches bio resin for HP-RTM processing
SR GreenPoxy 28 is a bio-based epoxy resin designed for fast cure, high performance, and more sustainable automotive manufacturing.

SWM launches Naltex flow media for resin infusion
SWM International (Alpharetta, Ga., U.S.) announces the introduction of Naltex flow media for resin infusion processes.

JEC World 2019 preview: Netzsch
Netzsch (Selb, Germany, 6/R20) is featuring technology it developed in collaboration with Kistler (Winterhur, Switzerland) to create advanced technology for intelligent composites parts production.

JEC World 2019 preview: Hexcel
Hexcel (Stamford, Conn., U.S.) is featuring range of composite innovations for customer applications in aerospace, automotive, energy and marine markets.

JEC World 2019 preview: Engel
At JEC World 2019, Engel Austria is presenting its technologies for organomelt processing, in-situ polymerization, HP-RTM and flow molding with SMC.

Hennecke announces second generation STREAMLINE metering machine for HP-RTM
The second generation of Hennecke’s STREAMLINE metering machines for HP-RTM and CLEARRIM/clearmelt applications boasts improved production flexibility. 

JEC World 2018 preview: KraussMaffei
KraussMaffei (Hall 6, F61) is featuring several composites manufacturing technologies, covering wet molding, pultrusion, long fiber injection and overmolding.