Noncontact, optical testing system takes the guesswork out of traditional test methods

Trilion Quality Systems’ (King of Prussia, Pa., U.S.) Aramis optical testing system is a noncontact, material-independent measuring system that provides critical data such as full-field optical strain, 3D displacement and vibration analysis with ease. Aramis is said to be a clear alternative for foil gages and extensometers while being 10 times cheaper than a traditional mechanical gage, 50 times less labor/time-intensive and provides 100 times more data. With countless applications from finite element analysis (FEA) validation, material/structural testing/structural health monitoring and high-speed measurements, the Aramis system is being used for a wide range of industries — automotive, aerospace, biomechanics and more — making it the first tool of choice when it comes to material and structural testing.

At Aramis’ core is 3D digital image correlation (3D-DIC), a noncontact measuring technique based on advanced image processing. DIC is capable of mapping 3D coordinates and evaluating displacement and strain maps on the surface of measured samples. This technique uses a stochastic pattern and/or point markers to track the surface of the materials with subpixel accuracy or microns of motion.

Just how accurate? Aramis 3D-DIC can provide precision measurements, matching any clip gage, strain gage or extensometer, according to Trilion. Aramis is certified as ISO 9513 class 0.5 extensometer. Measurements provide thousands of data points in all three axes with high accuracy for material property evaluations.

Trilion’s engineering services are provided for customers who want to see how the technology works before committing to a purchase. The company’s services are ideal for solving complicated applications or developing measurement methods for critical tests. Trilion provide experienced engineers, with industry-specific experience from material characterization to advanced testing, in a multitude of industries. Engineering services full-field 3D displacement mapping during component testing, optical strain field for FEA validation, high-speed measurements and vibration analysis and large scale structural testing.