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9/17/2019 | 1 MINUTE READ

CAMX 2019 preview: Technical Fibre Products

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Technical Fibre Products is exhibiting its nonwoven solutions for advanced composites.

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Technical Fibre Products (TFP, Schenectady, N.Y., U.S.) is exhibiting its nonwoven solutions for advanced composites. On display will be materials from TFP’s Optiveil, Optimat and Tecnofire ranges, specifically designed for use in composites. These materials, which are said to constitute the lightest weight and broadest range of wet-laid nonwovens in the world, can fullfil a number of functions in an advanced composite structure. These include:

  • Enabling a high-quality, resin-rich surface finish

  • Imparting surface functionality such as EMI shielding, corrosion resistance, abrasion resistance, electrical conductivity and static dissipation

  • Providing a lightweight, effective carrier or support for adhesive films and fragile materials. The veil ensures a defined and consistent film thickness while improving handling and resilience

  • Delivering highly effective, integrated fire protection at the surface of a composite without compromising the integrity of the structure

  • Increasing the mode-I and mode-II interlaminar fracture toughness of a composite structure by up to 400%

  • Acting as a resin flow medium to provide enhanced resin transportation in both inter-laminar and surface regions; Optiveil and Optimat reportedly remove the need to use additional flow media and ultimately reduce resin usage and scrap

  • Preventing galvanic corrosion; TFP’s dielectric nonwovens act as an electrically isolating layer between dissimilar conductive materials to prevent the electrochemical reaction that causes galvanic corrosion.

TFP also specializes in developing or adapting materials to meet customer specific performance, processing and aesthetic requirements. This is enabled by extensive product development capabilities, ranging from proof of concept lab work to trials, full-scale manufacture and converting via lamination and nanocoating. Booth N30.

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