NanoSperse LLC
Design/development/supply of nano-enhanced resins for proprietary customer applications. Masterbatches of carbon nanotubes and carbon nanofibers in customer-specified resins (thermoset, thermoplastic and elastomeric). Cocure nano-enhanced surface films for electrical conductivity, thermal management and improved durability. Manufacturing of customer formulations.As Seen In CompositesWorld
SouthWest NanoTechnologies names NanoSperse certified compounder
Ohio-based NanoSperse Inc. has been named a certified compounder of SouthWest NanoTechnologies' SMW specialty multiwall carbon nanotubes, with emphasis on elastomer and thermoset resin compounds.
New Airbus consortium established at the National Composite Center
Airbus will work through the National Composite Center in Ohio to develop a research and development consortium of Ohio aerospace supplier, incubators and universities to develop next-generation products for use in new Airbus aircraft.
SAMPE 2010 Seattle Showcase
SAMPE’s first-ever foray into Boeing Country wrapped up with the M&P organization’s biggest draw this decade.
Additives Add Key Innovations
Added in small quantities, these resin system enhancements make larger contributions to composite quality as suppliers enhance their utility.
Post-show review of the 2004 U.S. SAMPE Symposium
Largest-ever Symposium serves up a large helping of news and new technologies from advanced composites suppliers.
- Matrix resins, thermoplastic
- Nylon (polyamide)
- Polyether ketone family (PEK, PEKK, PEEK)
- Polyetherimide
- Polyethersulfone
- Polyimide
- Polypropylene
- Polyurethane
- Matrix resins, thermoset
- Bismaleimide (BMI)
- Cyanate ester
- Phenolic
- Polybutadiene
- Polyimide
- Urethane
- Epoxy
- Epoxy, 250 F cure
- Epoxy, 350 F cure
- Epoxy, toughened
- Adhesives
- Bismaleimide
- Bismaleimide, Film
- Bismaleimide, Hot melt
- Bismaleimide, Paste
- Bismaleimide, Water-based
- Epoxy
- Epoxy, Film
- Epoxy, Hot melt
- Epoxy, Paste
- Epoxy, Water-based
- Epoxy, Other
- Nylon
- Nylon, Hot melt
- Phenolic
- Phenolic, Film
- Phenolic, Hot melt
- Phenolic, Paste
- Phenolic, Solvent-based
- Phenolic, Water-based
- Polyimide
- Polyimide, Film
- Polyimide, Hot melt
- Polyimide, Paste
- Polyimide, Water-based
- Silicone
- Silicone, Paste
- Silicone, Solvent-based
- Urethane
- Urethane, Film
- Urethane, Hot melt
- Urethane, Paste
- Urethane, Solvent-based
- Urethane, Water-based
- Other
- Other, Film
- Other, Hot melt
- Other, Paste
- Other, Water-based
- Bismaleimide
- Coatings and sizings
- Conductive
- EMI-attenuation
- Electrostatic
- Casting resins
- Epoxy
- Compounds
- Bulk molding (BMC)
- Thermoplastic, short fiber-reinforced
- Thick molding
- Fillers
- Alumina trihydrate
- Nanoclays/nanofibers
- Silica
- Silica, amorphous
- Wollastonite
- Resin additives & modifiers
- Ablatives
- Conductive fillers
- Nanomaterials (carbon nanotubes, fullerenes, etc.)
- Tools
- Hybrid materials
- Tooling equipment, materials and supplies
- Backup structures
- Flexible mold materials
- Master pattern material, polymeric
- Product design