Optically clear, toughened two-part epoxy
Master Bond Inc. has introduced EP38CL, a two-part adhesive developed for bonding, sealing, coating and encapsulation applications that require toughness and durability.

High-shear, high-peel epoxy adhesive
Master Bond has announced the availability of Master Bond Supreme 10HT, an epoxy adhesive that combines high shear and peel strengths with convenient handling.

Nanosilica-filled, UV-curable epoxy
Master Bond Inc. (Hackensack, N.J.) has developed UV22, a new nanosilica-filled, single-component, UV-curable epoxy. The compound has been designed for coating, sealing and encapsulation applications and reportedly features good abrasion resistance, strong optical clarity, low shrinkage and high physical strength

Two-part elastomeric adhesive
Master Bond Inc. (Hackensack, N.J.) has developed EP30D-12, a two-component elastomeric adhesive that reportedly features high levels of strength, toughness and chemical resistance. According to the company, the product combines the adhesive strength and chemical resistance characteristics of an epoxy with the

Ambient-cure epoxy adhesive
Master Bond Inc. (Hackensack, N.J.) has introduced EP21TDCSFL, a new two-component (1:1), room-temperature cure, silver-filled epoxy adhesive. The material has an elongation of more than 60 percent. Properties include a volume resistivity of less than 10-3 ohm/cm, mechanical shock resistance, low outgassing, service

Casting and potting compound
Master Bond (Hackensack, N.J.) has released MasterSil 151, a two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a

Casting potting compound
Master Bond (Hackensack, N.J.) has released MasterSil 151, a new two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a

High-performance cure at low temperatures
Master Bond Inc.’s (Hackensack, N.J.) new EP27 epoxy resin system has a noncritical mix ratio of 2:1 by weight or volume and a mixed viscosity of only 2,000 cps. Applied in 6-mil thick films, the adhesive will set in as little as two hours at only 40°F and will cure in 48 to 72 hours. The material reportedly features

Low-temp cure epoxy
Master Bond Inc.’s (Hackensack, N.J.) newly developed epoxy resin system called Master Bond EP27, is designed to overcome persistent problems with achieving high-performance cures at low temperatures. Master Bond Inc. This new formulation, according to the manufacturer, successfully overcomes this problem Available in

Epoxy Bonding/Sealing Resin - 7/1/2007
Master Bond Inc.’s (Hackensack, N.J.) new EP21TDC-2LO epoxy resin-based, high-performance bonding, sealing, coating and encapsulation system is curable at room temperature or more rapidly at elevated temperatures. The product has a 1:3 mix ratio, by weight or volume, and a working life of more than 90 minutes for a

Epoxy bonding/sealing resin
Master Bond Inc.’s (Hackensack, N.J.) EP21TDC-2LO epoxy resin-based, high-performance bonding, sealing, coating and encapsulation system has a 1:3 mix ratio by weight or volume and a working life of more than 90 minutes for a 100g/3.5 oz quantity. Reportedly, little exotherm is developed during cure, making it

Bonding Technology: Thermosetting Structural Adhesives
A wealth of epoxies, polyurethanes and acrylics speed assembly and cut manufacturing cost in an ever-wider range of composites applications.

Ambient-Cure Epoxy
Master Bond Inc.’s (Hackensack, N.J.) new EP21HT two-component, room-temperature curing epoxy adhesive has a 1:1 mix ratio by weight or volume, is 100 percent reactive, contains no solvents or volatiles and has a service operating temperature range of 60°F to 400°F (51°C to 204°C). It reportedly offers tensile

Light-transparent adhesives
MasterSil 415, a new one-component silicone elastomer bonding, sealing and coating compound from Master Bond Inc. (Hackensack, N.J.), has transparency sufficient for optical and display applications. According to the company, it cures at ambient temperatures to a flexible, rubbery solid when exposed to atmospheric

Polymer Adhesive
Master Bond (Hackensack, N.J.) has developed a new highly flexible, two-component epoxy resin compound called EP40 that features high shear and peel strength. It has been designed especially for sealing and casting engineering plastics and metals. The compound is formulated to cure readily at ambient temperature or

Conductive adhesives
Master Bond Inc. (Hackensack, N.J.) developed EP21TCHT-1, a new, two-component, thermally conductive, electrically insulative epoxy adhesive. The compound meets NASA's low outgassing specifications and has a service operating temperature of as high as 204°C/400°F. The material is formulated to cure at room

Conductive epoxy adhesive
Master Bond Inc. (Hackensack, N.J.) has developed EP77M-F, a new two component, silver-filled, electrically conductive epoxy adhesive for high performance bonding. It has a low-volume resistivity and sets up in 5 to 10 minutes, with full cure achieved in 8 to12 hours at room temperature. It has a 1:1 mix ratio, by

Fast-cure epoxy adhesive - 11/1/2004
Master Bond Inc.'s (Hackensack, N.J., U.S.A.) EP24 fast-cure, two-component epoxy adhesive cures at room temperature or more rapidly at elevated temperatures, but also will cure at temperatures as low as -6°C/20°F. The 100 percent reactive material contains no volatiles or solvents and is mixed to a convenient,