TCPoly thermal conductive filaments for 3D printing
The Ice9 product offerings are composed of carbon-based fillers and ceramic filler parts.
Source | TCPoly
Thermal solutions provider, TCPoly (Atlanta, GA, U.S.) features the developments of its TCPoly Ice9 thermally conductive filaments, the first heat-conducting plastics for open source FDM 3D printers. Composed of a mix of carbon-based fillers and ceramic filler particles, the 3D printing filaments are said to retain a thermal conductivity up to 50 times higher than standard filaments (10 W/mK
TCPoly offers three varying Ice9 filament products. Flex (TPE), said to have the highest thermal conductivity at 8 W/mK and high toughness, is available in electrically insulated grades. Retaining a tensile strength of 15 MPa, maximum temperature use holds at 110ºC. Rigid (PA6) is a nylon-based filament with the second highest thermal conductivity at 4 W/mK, a tensile strength of 30 MPa and overall high modulus and temperature stability. Finally, Aero (PEKK), in addition to its thermal conduction of 2.5 W/mK, is flame-retardant with a temperature stability above 250ºC and a tensile strength of 100 MPa.
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