PolyOne launches thermoplastic EMI/RFI shielding formulations
The portfolio of conductive thermoplastic materials shields sensitive electronics from both electromagnetic interference (EMI) and radio frequency interference (RFI).
PolyOne (Cleveland, OH, US) announced Jan. 16 it has rebranded ElectriPlast material technology as Surround EMI/RFI Shielding Formulations. The portfolio of conductive thermoplastic materials shields sensitive electronics from both electromagnetic interference (EMI) and radio frequency interference (RFI). According to PolyOne, Surround weighs up to 60% less than aluminum or copper, and brings increased design freedom versus metal.
The company says the long-fiber material is well suited to housings for advanced driver assistance systems (ADAS) because of its capability to replace metal in shielding applications. As automakers continue to add ADAS functionality to automobiles, more electronic control units (ECUs), cameras and sensors are needed to make the systems function properly.
Surround material is said to be lighter weight and easier to process than traditional materials such as aluminum or copper. It is Injection moldable, allowing for thinner wall housings, more complex shapes and fewer design constraints than aluminum or copper without compromising on dimensional stability of the component during use. It is also reported to be durable and non-corrosive.
With its integrated EMI/RFI shielding capabilities, Surround material adds depth to PolyOne’s existing electrically conductive and shielding material lineup. It is also well positioned for additional shielding applications, including camera housings and connectors beyond the automotive market.
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