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11/1/2007

Casting and potting compound

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Master Bond (Hackensack, N.J.) has released MasterSil 151, a two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a

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Master Bond (Hackensack, N.J.) has released MasterSil 151, a two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a service operating temperature of -65°F to 400°F (-54°C to 204°C). Elongation at break of 160 percent and Shore A hardness of 45 give the product good resistance to vibration, impact and shock, says the manufacturer. Dielectric strength is 460 volts/mil and volume resistivity is 1×1015 ohm/cm. Mix ratio is 10:1 by weight. Low viscosity reportedly ensures complete fill-in around complicated contours and other high-detail configurations.

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