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1/1/2008

Ambient-cure epoxy adhesive

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Master Bond Inc. (Hackensack, N.J.) has introduced EP21TDCSFL, a new two-component (1:1), room-temperature cure, silver-filled epoxy adhesive. The material has an elongation of more than 60 percent. Properties include a volume resistivity of less than 10-3 ohm/cm, mechanical shock resistance, low outgassing, service

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Master Bond Inc. (Hackensack, N.J.) has introduced EP21TDCSFL, a new two-component (1:1), room-temperature cure, silver-filled epoxy adhesive. The material has an elongation of more than 60 percent. Properties include a volume resistivity of less than 10-3 ohm/cm, mechanical shock resistance, low outgassing, service operating temperatures of -452°F to 250°F (-269°C to 121°C), tensile shear strength of more than 1,500 psi/10.34 MPa and a T-peel strength of more than 30 lb/inch at 75°F/24°C. The compound is said to be particularly suited for bonding dissimilar substrates that will be thermally cycled and shocked in service.

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