CompositesWorld Expo online registration is open

Registration is free for CompositesWorld Expo 2009, Sept. 28-30, in Schaumburg, Ill. Also announced this week is the fourth keynote speaker for CompositesWorld Expo, Dr. Habib Dagher, director, Advanced Engineered Composites Center, University of Maine.

CompositesWorld Expo 2009, Sept. 28-30 in the Chicago suburb of Schaumburg, Ill., has announced that online attendee registration is now open. Visit to register. Registration is free until Sept. 28 and $30 onsite.

CompositesWorld Expo, in its second year, provides a two-day conference (Sept. 28-29) overlapping with a two-day expo (Sept. 29-30) featuring suppliers of fiber, resin, machinery, software, tooling, and services for composites manufacturing operations. The two-track conference provides a beginners' track featuring manufacturing information for professionals just learning about composites manufacturing materials and processes, and an advanced track for experienced professionals looking to enhance their composites knowledge. Cost of the conference is $595 before Aug. 14, and $695 after Aug. 14. Visit for more information.

This year's expo features four keynote speakers, each focusing on a different composites end market:

— "20% Wind By 2030: The role of Industry, Government and Advanced Materials Technology," by Stephen Nolet, principal engineer & director of innovation, TPI Composites

JUST ANNOUNCED: “Bridge in a Backpack – Rigidified Inflatable Composites for Bridge Construction and Other Infrastructure Opportunities," by Dr. Habib Dagher, director, Advanced Engineered Composites Center, University of Maine

—"The Role of Composites in a Changing Automotive Landscape," by Jim deVries, Lightweight Materials Group, Manufacturing Systems Department, Ford Motor Co.

— "Innovations for Aerospace Leadership," Peter Wu, Ph.D., vice president/chief scientist, Spirit AeroSystems Inc.

For more information on the conference, expo, speakers, registration, lodging or transportation, visit, or call 513-527-8800 ext. 254.