Large-Scale Thermoset Additive Tooling: Advancing the CAD to Tool Process
August 20, 2020
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Thermoset materials have been used in composites manufacturing for decades, but MVP recently developed a Reactive Additive Manufacturing (RAM) system to offer new potential for the material for use in high performance markets. The RAM enables stronger, more energy-efficient tools with improved thermal properties and can achieve FDM-scale features while still delivering a high output.
- Differences in large-scale thermoplastics vs. thermoset
- Exotherm and conformance to optimize parameters
- Applications for reactive additive manufacturing (RAM)
- Integrating RAM systems into Industry 4.0 landscape
Senior Product Manager, Magnum Venus Products
At Magnum Venus Products (MVP), Mike leads the Thermoset 3D Printer project as Senior Product Manager. Mike has extensive experience in product management, operations, marketing, project management, and business development in a broad range of industries. Mike has a Masters of Business Administration (MBA) from the University of Tennessee, a Bachelor of Science in Biology from the University of South Florida and is a Certified Project Management Professional (PMP) with the Project Management Institute.
Dr. Christopher J. Hershey
R&D Associate, Manufacturing Science Group; Oak Ridge National Laboratory (ORNL)
Dr. Christopher J. Hershey is an R&D Associate in the Manufacturing Science Group at Oak Ridge National Laboratory and is the project lead in Large Scale Reactive Polymer Additive Manufacturing. He joined Oak Ridge National Laboratory in 2018 as a Post-Doctoral Research Associate in the Polymer Materials Development Team located in the Manufacturing Demonstration Facility. He obtained his Ph.D. in chemical engineering from Michigan State University where he studied nonlinear rheology of polymer nanocomposites under the advisement of Dr. K. Jayaraman. Dr. Hershey now directs his experience with the rheology of thermoplastics, thermosets, composites, and foams to additive manufacturing.