Dyna-Purge and 3Dom Develop 3D Purging Compound
The new Dyna-Purge 3D Clean purging compound is geared to a broad range of FDM 3D printers.
By partnering with 3Dom USA, Fargo, N.D., Schuman Plastics’ Dyna-Purge Div., Depew, Buffalo has introduced a new grade of a safe, non-abrasive, non-chemical, FDA compliant engineered thermoplastic purging compound specially formulated for FDM (Fusion Deposition Modeling) 3D printers.
Dyna-Purge 3D Clean, is reportedly ideal for a wide range of 3D printing applications including plastic prototyping, multi-color 3D prints, low-volume production and others that require multiple color and resin changes for a broad range of FDM systems. The new compound is designed to purge all resins used in 3D printing. It is reportedly easy-to-use before or after printing a part, for color changes, resin changes, especially composite materials such as glass-filled nylons, and for preventative machine maintenance. Its ease-of-use is delivered through an innovative cleaning formulation and wide processing temperature range—from 320˚F to 575˚F.
It comes in 8-in. long strands (1.75mm and/or 2.85mm diameter) and packaged in a clear cylinder.
Want to find or compare materials data for different resins, grades, or suppliers? Check out Plastics Technology’s Plaspec Global materials database.
Related Content
-
Aluula introduces lightweight composite materials for wind sports and beyond
The company’s proprietary UHMWPE fabrics combined with technical films in a patented fusion process are said to increase performance and recyclability.
-
JEC World 2022, Part 2: Recycling, natural fibers and additive manufacturing
CW associate editor Hannah Mason recaps several technologies seen on display at JEC World 2022, including new developments from Bcomp, Massivit 3D, Gen 2 Carbon and more.
-
Materials & Processes: Fibers for composites
The structural properties of composite materials are derived primarily from the fiber reinforcement. Fiber types, their manufacture, their uses and the end-market applications in which they find most use are described.