PUBLISHED: 10/4/2018

Evonik launches low-odor reactive diluent

In adhesive formulations, composite resins and gel coats, the reactive diluent can replace styrene and methyl methacrylate, either partially or in full. 


PUBLISHED: 10/3/2018

Airtech launches high temperature vacuum bagging materials for thermoplastic molding

The company has released a new high performance release film, a new sealant tape for high temperature applications and non-woven blended, fiberglass breathers.


PUBLISHED: 9/26/2018

Roth unveils robot filament winding machines

The technology uses a six-axis robot to move the fiber delivery eye – used for the fiber guide during the winding.


PUBLISHED: 9/22/2018

New SAERTEX products offer fire protection

The company has released two new products in the area of fire protection for composites, SAERTEX LEO Coated Fabric and SAERcore LEO.


PUBLISHED: 9/20/2018

BASF develops particle foam based on polyethersulfone

New foam is characterized by high-temperature resistance, inherent flame retardancy and light weight coupled with good stiffness and strength.


PUBLISHED: 9/19/2018

New carbon fiber filament brings 3D printing closer to industrial production

Royal DSM launches new carbon fiber filled grade PA6/66 filament Novamid ID1030 CF10 for 3D printing.


PUBLISHED: 9/17/2018

Asahi Kasei launches Thermylene P11

Next-generation family of glass-reinforced polypropylene (PP) compounds opens new opportunities for thinwall molding of interior and exterior automotive parts.


PUBLISHED: 9/14/2018

Latest Moldex3D version improves RTM simulation workflow

Latest Moldex3D version includes more control over complex layer layer orientations and improved RTM pre-processing workflow. 


PUBLISHED: 9/13/2018

New modular direct diode laser technology for tape replacement applications

New diode laser technology aims to scale up the production capability of tape placement systems.


PUBLISHED: 9/12/2018

Second Generation In-Mold Electronic materials enable embedded touch control and lighting

DuPont’s second generation of In-Mold Electronic (IME) materials boasts key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric.


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