CS Hyde Co. (Lake Villa, Ill.) has introduced ultrahigh molecular weight (UHMW) High Bond (HB) tape that is said to combine the benefits of strong, slippery, abrasion-resistant UHMW polyethylene tape and a superhigh-bond adhesive. UHMW High Bond has been designed for difficult-to-bond, low-surface-energy materials, including those that are plastic, powder-coated, foamy, oily metallic or slightly textured.