Master Bond Inc.
(Hackensack, N.J., U.S.A.) offers its new EP21AO epoxy adhesive, a two-part, thermally conductive, electrically isolating formulation with a forgiving 1:1 mix ratio (by weight or volume). The mixed material is self-leveling, 100 percent reactive and contains no solvents or other volatiles, and achieves thermal conductivity of 10 BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. It reportedly adheres to a variety of similar and dissimilar substrates, with low coefficient of expansion (CTE) and shrinkage, and good dimensional stability, durability and chemical resistance. EP21AO has Shore D hardness greater than 85 and tensile strength of 5,000 psi. Service temperature range is -51°C to 121°C (-60°F to +250°F).