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April 2004
Thermally conductive epoxy adhesive

Master Bond Inc. (Hackensack, N.J., U.S.A.) offers its new EP21AO epoxy adhesive, a two-part, thermally conductive, electrically isolating formulation with a forgiving 1:1 mix ratio (by weight or volume). The mixed material is self-leveling, 100 percent reactive and contains no solvents or other volatiles, and

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Posted on: 4/1/2004
Source: Composites Technology

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Brushing on Master Bond adhesive

Source: Source: Master Bond

Master Bond Inc. (Hackensack, N.J., U.S.A.) offers its new EP21AO epoxy adhesive, a two-part, thermally conductive, electrically isolating formulation with a forgiving 1:1 mix ratio (by weight or volume). The mixed material is self-leveling, 100 percent reactive and contains no solvents or other volatiles, and achieves thermal conductivity of 10 BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. It reportedly adheres to a variety of similar and dissimilar substrates, with low coefficient of expansion (CTE) and shrinkage, and good dimensional stability, durability and chemical resistance. EP21AO has Shore D hardness greater than 85 and tensile strength of 5,000 psi. Service temperature range is -51°C to 121°C (-60°F to +250°F).

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