Applied Chemical Laboratories Inc. (Sunnyvale, Calif.) has introduced EpoxSol ACL-23 a solvent for cleanup of epoxy and polyester resins. Derived from technology used to clean microelectronic components, the solvent has a high boiling point that reportedly enables removal of cured resins in a single application, without gumming or drying. Optimized for fast-throughput cleaning cycles, the product is, according to its manufacturer, virtually odorless and contains no acetone, MEK or MIBK and can be used in spray or immersion-tank applications. A wide process latitude allows operating temperatures to range from 23°C to 80°C for thick, highly crosslinked resins. Further, the solvent is formulated to be noncorrosive to metals.