Master Bond Inc. (Hackensack, N.J.) has developed UV22, a new nanosilica-filled, single-component, UV-curable epoxy. The compound has been designed for coating, sealing and encapsulation applications and reportedly features good abrasion resistance, strong optical clarity, low shrinkage and high physical strength properties. It cures rapidly at room temperature upon exposure to a UV light source and is not oxygen inhibited. Service operating temperature is 60°F to 300°F (-50°C to 150°C). Postcuring enhances its temperature resistance profile. Postcure at 195°F to 257°F (90.6°C to 125°C) for 30 minutes raises the resin’s glass transition temperature to 275°F/135°C and increases its resistance to chemicals, including solvents, acids and bases. The manufacturer says that despite a relatively high percentage of nanoparticles (>35 percent) in the epoxy, it retains high transparency and low viscosity without sedimentation, thanks to the agglomerate-free colloidal dispersion of the nanoparticles in the resin. The resin has a Shore D hardness of 80 and a tensile strength of 4,600 psi/31.72 MPa. Also new is an epoxy potting and encapsulation compound called EP30FL. The material features low viscosity and easy application. It can be used in thick and thin cross-sections, is 100 percent reactive, does not contain volatiles, generates little exotherm during cure, has low shrinkage, adheres to similar and dissimilar substrates and is designed for use in high thermal cycling environments.