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August 2007
Low-temp cure epoxy

Master Bond Inc.’s (Hackensack, N.J.) newly developed epoxy resin system called Master Bond EP27, is designed to overcome persistent problems with achieving high-performance cures at low temperatures. Master Bond Inc. This new formulation, according to the manufacturer, successfully overcomes this problem Available in

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Posted on: 8/1/2007
Source: Composites Technology

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Master Bond Inc.’s (Hackensack, N.J.) newly developed epoxy resin system called Master Bond EP27, is designed to overcome persistent problems with achieving high-performance cures at low temperatures. Master Bond Inc. This new formulation, according to the manufacturer, successfully overcomes this problem Available in 6-mil thick films, the material will set in as little as two hours at temperatures as low as 40°F/4.4°C and will cure in 48 to 72 hours. The epoxy reportedly has a convenient noncritical 2:1 mix ratio (by weight or volume) and a desirable low mixed viscosity of only 2,000 cps. The cured epoxy resin system is designed to offer outstanding physical strength properties and excellent chemical resistance, i.e., long term resistance to immersion in aggressive solvents such as ethanol, toluene, butyl cellosolve, 70 percent sulfuric acid, 30 percent nitric acid, 50 percent sodium hydroxide and bleaches. It also has high bond strength to metallic and nonmetallic substrates.

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