Instant high-temperature repair epoxy from Cotronics

Cotronics Corp. (Brooklyn, N.Y., U.S.A.) introduces Bond-It 7056, a 204°C/400°F epoxy that bonds dissimilar materials immediately, requiring no clamps, and cures in as little as four minutes at 93°C/200°F (one to two minutes at room temperature). The cured adhesive has tensile strength, at room temperature, of 3,000

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instant epoxy adhesive

Source: Cotronics

Cotronics Corp. (Brooklyn, N.Y., U.S.A.) introduces Bond-It 7056, a 204°C/400°F epoxy that bonds dissimilar materials immediately, requiring no clamps, and cures in as little as four minutes at 93°C/200°F (one to two minutes at room temperature). The cured adhesive has tensile strength, at room temperature, of 3,000 psi and can bridge gaps as wide as 0.25 inch. The product exhibits Shore D hardness of 65 and elongation of only 3 percent. Bond-It 7056AL is aluminum-filled to provide a fast-setting, machinable repair epoxy. .

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