Hexion launches low free formaldehyde phenolic

Originally titled ' Low free formaldehyde phenolic'

Hexion Inc. (Columbus, OH, US) is introducing a new phenolic resin for composites with an ultra-low free formaldehyde (ULEF) content of less than 0.1%.

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Hexion Inc. (Columbus, OH, US) is introducing a new phenolic resin for composites with an ultra-low free formaldehyde (ULEF) content of less than 0.1%. The new, lower volatile organic compound (VOC) Cellobond J2027-X01 resin maintains the Cellobond product line’s capability in fire, smoke and toxicity (FST) performance while providing improved safe use and handling. The ULEF resin contains one-tenth the free formaldehyde of previous systems. This results in reduced emissions during composites manufacturing, particularly during open-mold processes such as hand lay-up. The matrials, says Hexion, meets European Fire Safety Standard EN 45545-2.