At JEC Europe 2014, Cytec Industries Inc. (Woodland Park, N.J.) launched new products and accompanying technologies for serial automotive production. XMTR50, a new, two-part epoxy resin system, was developed specifically for the high-rate manufacture of components using a high-pressure resin transfer molding (HP-RTM) process,. Cytec claims the epoxy is capable of a cycle time of three minutes at 120°C/250°F for a Tg of 135°C/275°F.
Also new, MTM 23, the industry's first application of a volatile-organic compound (VOC)-free thermoset vinyl hybrid resin woven glass-reinforced prepreg, enables the manufacture of parts by press molding in five minutes or less.
Cytec also introduced trademarked FM 3500 EZP peel ply, a resin‐rich, fiber-free composite bonding product that reportedly eliminates the need for additional prebond surface preparation. Formulated specifically for one‐piece removal, it is said to exhibit handling properties that support manufacturing efficiency. The peel ply’s long shop life, durability during extended cure cycles and compatibility with most 177°C/350°F‐cure prepregs allow for manufacturing flexibility.