Park Electrochemical Corp. (Melville, NY, US) introduced a new, toughened 177°C-cure epoxy resin aimed at automated fiber placement (AFP) processing. E-752-LT is designed for aerospace primary and secondary structural applications and is available in standard- and intermediate-modulus, precision-slit tapes and fabrics. It has been formulated to optimize efficient, high-volume AFP processing, says the company, with a controlled rheology specifically formulated for a wide range of cure methods (e.g., autoclave and press cure), while delivering as low as <1% void content. It provides a combination of toughness, low moisture absorption and good mechanical properties, with a dry Tg of 220°C and wet Tg of 157°C.
Editor PickMore companies join NASA’s Advanced Composites Consortium
The project’s goal is to reduce product development and certification timelines by 30 percent for composite aircraft.