Epoxy Bonding/Sealing Resin - 7/1/2007

Master Bond Inc.’s (Hackensack, N.J.) new EP21TDC-2LO epoxy resin-based, high-performance bonding, sealing, coating and encapsulation system is curable at room temperature or more rapidly at elevated temperatures. The product has a 1:3 mix ratio, by weight or volume, and a working life of more than 90 minutes for a

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Master Bond Inc.’s (Hackensack, N.J.) new EP21TDC-2LO epoxy resin-based, high-performance bonding, sealing, coating and encapsulation system is curable at room temperature or more rapidly at elevated temperatures. The product has a 1:3 mix ratio, by weight or volume, and a working life of more than 90 minutes for a 100g/3.5 oz quantity. The manufacturer says little exotherm is developed during cure, making the material suitable for use in both thick- and thin-sectioned configurations. The material meets NASA’s low-outgassing specifications and is said to provide good electrical insulation and thermal conductivity. Its service temperature range runs form -453°F to 250°F (-269°C to 121°C), and Shore D hardness is 36 with elongation of >50 percent, tensile strength of 1,070 psi/7.38 MPa and T-peel strength of >15 pli.