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March 2008
Epoxy-based film adhesive

Henkel Corp. (Bay Point, Calif.) has introduced a new a high-temperature, durable, epoxy-based film adhesive called Hysol EA 9658, developed for aerospace nacelle applications. It features extended toughness, good flow rheology, and is said to be ideal for bonding composites and metals. The material is a 177°C (350°F)

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Posted on: 3/1/2008
High-Performance Composites

Henkel Corp. (Bay Point, Calif.) has introduced a new a high-temperature, durable, epoxy-based film adhesive called Hysol EA 9658, developed for aerospace nacelle applications. It features extended toughness, good flow rheology, and is said to be ideal for bonding composites and metals. The material is a 177°C (350°F) cure system suitable for applications where continuous exposure (6,000-plus hours) to temperatures up to 177°C (350°F) is required. It offers a controlled flow, which enables it to perform well in reticulated sound suppression nacelle structures. A companion material is Hysol EA 9258.1, a water-based chromated primer.

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