Master Bond Inc. (Hackensack, N.J.) has developed EP77M-F, a new two component, silver-filled, electrically conductive epoxy adhesive for high performance bonding. It has a low-volume resistivity and sets up in 5 to 10 minutes, with full cure achieved in 8 to12 hours at room temperature. It has a 1:1 mix ratio, by weight or volume, and can be applied with minimal sag or drip. It reportedly contains no diluents or solvents and exhibits low outgassing.