Would you like a free digital subscription?

Qualified international subscribers can receive full issues of High-Performance Composites and Composites Technology delivered in a convenient and interactive digital magazine format. Read at your convenience on your desktop or mobile device.

Yes, I would like a free digital subscription!

No thanks, please don't ask again.

September 2005
Conductive epoxy adhesive

Master Bond Inc. (Hackensack, N.J.) has developed EP77M-F, a new two component, silver-filled, electrically conductive epoxy adhesive for high performance bonding. It has a low-volume resistivity and sets up in 5 to 10 minutes, with full cure achieved in 8 to12 hours at room temperature. It has a 1:1 mix ratio, by

Author:
Posted on: 9/1/2005
High-Performance Composites

Master Bond Inc. (Hackensack, N.J.) has developed EP77M-F, a new two component, silver-filled, electrically conductive epoxy adhesive for high performance bonding. It has a low-volume resistivity and sets up in 5 to 10 minutes, with full cure achieved in 8 to12 hours at room temperature. It has a 1:1 mix ratio, by weight or volume, and can be applied with minimal sag or drip. It reportedly contains no diluents or solvents and exhibits low outgassing.

Learn More

Editor's Picks

Related Suppliers

Master Bond Inc.


Channel Partners