Master Bond Inc. (Hackensack, N.J.) developed EP21TCHT-1, a new, two-component, thermally conductive, electrically insulative epoxy adhesive. The compound meets NASA's low outgassing specifications and has a service operating temperature of as high as 204°C/400°F. The material is formulated to cure at room temperature, but may be cured more rapidly at elevated temperatures. Available for use in half-pint, pint, quart, gallon and 5-gal container kits, the adhesive is 100 percent reactive and contains no solvents or diluents. It has a mix ratio of 100:60, by weight, with a mixed viscosity of light paste.