Casting potting compound
Master Bond (Hackensack, N.J.) has released MasterSil 151, a new two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a
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Master Bond (Hackensack, N.J.) has released MasterSil 151, a new two-component compound for use in casting, potting and encapsulation. This formulation is designed to cure at room temperature or more rapidly at elevated temperatures. Reportedly resistant to the negative effects of thermal cycling, the compound has a service operating temperature range of -65°F to +400°F (-54°C to 204°C). Elongation at break of 160 percent and Shore A hardness of 45 give the product high resistance to vibration, impact and shock, says the company. Dielectric strength is 460 volts/mil and volume resistivity is 1×1015 ohm/cm. Mix ratio is 10:1 by weight. Its low viscosity reportedly ensures complete fill-in around complex contours even in very complicated component configurations.
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