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October 2014
CAMX 2014 preview: NETZSCH Instruments

NETZSCH Instruments North America LLC (Burlington, Mass., USA) will introduce four new scientific instruments for characterization of composite materials at CAMX 2014.

Author:
Posted on: 8/29/2014
Source: Composites Technology

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DSC 214 Polyma

DSC 214 Polyma

LFA 467 HyperFlash

LFA 467 HyperFlash

DEA 288 Epsilon

DEA 288 Epsilon

DMA 242E Artemis

DMA 242E Artemis

NETZSCH Instruments North America LLC (Burlington, Mass., USA) will introduce four new scientific instruments for characterization of composite materials at CAMX 2014. These include a differential scanning calorimeter, DSC 214 Polyma, with live demonstration; flash thermal diffusivity/conductivity analyzer, LFA 467 HyperFlash; dielectric thermoset curing monitor, DEA 288 Epsilon; dynamic mechanical analyzer, DMA 242E Artemis.

DSC 214 Polyma differential scanning dalorimeter is used to characterize the heat flow behavior in composite materials both pre- and post-cure, including glass transition, melting points, heat of curing reaction and thermal kinetics/reaction rate of cure behavior from cryogenic temperatures up to 600°C/1,112°F. The new DSC is designed for use in R&D and QC/QA applications and features unique software to identify unknown polymers in material mixtures. Dr. Pam Shapiro will perform live demonstrations of the DSC system at the company’s booth during CAMX.

Also new is LFA 467 HyperFlash flash analyzer for characterization of thermal diffusivity, thermal conductivity and specific heat of composite materials. The instrument performs non-destructive testing on up to 16 samples from -125°C/-193°F to 500°C/932°F and measures the time needed for heat energy to transfer through a composite structure. This time-response is used to then calculate the thermal conductivity of the material.

The new DEA 288 Epsilon will be featured for in-situ cure monitoring of thermoset resins used in composites. The instrument’s electrode sensors can be fed directly into composite parts that are placed in ovens, autoclaves or in molds to determine their optimum curing parameters and time of cure completion.     

Last, the company will display the new DMA 242E Artemis dynamic mechanical analyzer, which is used to accurately measure viscoelastic properties, glass transition temperature and curing behaviors of heavily-filled composite materials from cryogenic temperatures up to 600°C/1,112°F. The instrument features a variety of sample fixtures including three-point bending, single and dual-cantilever as well as shearing and compression.  

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