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April 2007
Ambient-Cure Epoxy

Master Bond Inc.’s (Hackensack, N.J.) new EP21HT two-component, room-temperature curing epoxy adhesive has a 1:1 mix ratio by weight or volume, is 100 percent reactive, contains no solvents or volatiles and has a service operating temperature range of 60°F to 400°F (51°C to 204°C). It reportedly offers tensile

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Posted on: 4/1/2007
Source: Composites Technology

Master Bond Inc.’s (Hackensack, N.J.) new EP21HT two-component, room-temperature curing epoxy adhesive has a 1:1 mix ratio by weight or volume, is 100 percent reactive, contains no solvents or volatiles and has a service operating temperature range of 60°F to 400°F (51°C to 204°C). It reportedly offers tensile strength of >8,000 psi/>55.16 MPa, a tensile modulus of >350,000 psi/>2,413.16 MPa and bonds well to both similar and dissimilar substrates (metals, glass, ceramics, wood, rubbers and many plastics). When cured, the material has a volume resistivity of >1,014 ohm-cm, Shore D hardness of >70, a coefficient of thermal expansion of 50 in/in x 10-6/°C and withstands thermal cycling and many chemicals, including water, oils, fuels, acids, bases and salts.

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