Nexeo Solutions (The Woodlands, TX, US) has launched a new website (www.nexeo3d.com) that provides exclusive access to Arnitel ID and Novamid ID, premium filament grades specifically designed by DSM (Singapore) for the 3D printing market.
The new e-commerce platform enables customers to buy filaments or order samples. Nexeo’s years of experience of working with a wide range of thermoplastic materials plus DSM’s deep material technology and application know-how delivers in-depth content to help guide customers to selecting the right material for their needs.
Nexeo Solutions 3D is a specialized group within Nexeo Solutions that focuses primarily on premium 3D printing filaments for fused filament fabrication (FFF) technology servicing a broad cross-section of industries, including automotive, healthcare, electrical/electronics, packaging, and sports and leisure and to meet the needs of high demanding professional consumers who want improved properties of their 3D printed objects with excellent layer-to-layer adhesion and higher printer speed.
Arnitel ID is a highly flexible TPC (thermoplastic copolyester) used in electronics, sports and a wide range of other applications. It is a flexible polymer with very good UV- and chemical-resistance compared to other flexible polymers such as TPU (thermoplastic urethane), reaching elongation at break of up to 400%, according to DSM. Arnitel ID exhibits no buckling, higher print speed, unbeaten layer-to-layer adhesion compared to ABS, PLA, TPU used in the 3D printing market.
Novamid ID is a very ductile, strong polymer suitable for harsh environments and high temperatures, up to 150°C, offering excellent layer-to-layer adhesion, strength and toughness. Since Novamid ID’s bridging performance is unique, the high crystallinity of the polymer allows designs with overhangs.
Editor PickArburg ‘Technology Days’ Host 6700 Visitors, Displays Several Novelties
The first metal-powder injection molded smartphone frame, PP-IML containers molded in under 2 sec, a new additive-manufacturing development center, and numerous hints of innovations yet to come.